Technical parameters/frequency: | 333 MHz |
|
Technical parameters/RAM size: | 262144 b |
|
Technical parameters/operating temperature (Max): | 90 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | BGA-256 |
|
Dimensions/Length: | 17 mm |
|
Dimensions/Width: | 17 mm |
|
Dimensions/Height: | 1.2 mm |
|
Dimensions/Packaging: | BGA-256 |
|
Physical parameters/operating temperature: | 0℃ ~ 90℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LC5512MB-45F256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG
|
||
LC5512MB-45FN256C
|
Lattice Semiconductor | 类似代替 | BGA-256 |
CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG
|
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