Technical parameters/number of contacts: | 24 |
|
Technical parameters/Contact electroplating: | Tin Lead, Tin |
|
Technical parameters/installation angle: | 180 ° |
|
Encapsulation parameters/installation method: | Through Hole |
|
Package parameters/number of pins: | 24 |
|
Dimensions/Length: | 30.5 mm |
|
Dimensions/Width: | 17.8 mm |
|
Dimensions/Height: | 2.79 mm |
|
Physical parameters/contact material: | Beryllium Copper |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review