Encapsulation parameters/installation method: | Through Hole |
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Other/Contact Forms: | DPDT (2 Form C) |
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Other/Contact Termination: | Solder Pin |
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Other/Matching Styles: | Through Hole |
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Other/Coil Types: | Non-Latching |
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Other/Factory Pack Quantity: | 1 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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