Encapsulation parameters/Encapsulation: | DO-213AA |
|
Dimensions/Packaging: | DO-213AA |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microchip | 功能相似 | DO-213AA-2 |
无铅封装用于表面安装齐纳二极管500mW的 LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW
|
||
JANTX1N5519BUR-1
|
Microsemi | 功能相似 | DO-213AA |
无铅封装用于表面安装齐纳二极管500mW的 LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW
|
||
JANTX1N5519BUR-1
|
M/A-Com | 功能相似 | DO-213AA |
无铅封装用于表面安装齐纳二极管500mW的 LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW
|
||
JANTXV1N5519BUR-1
|
Microsemi | 功能相似 | DO-213AA |
无铅封装用于表面安装齐纳二极管500mW的 LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW
|
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