Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TSSOP-28 |
|
Dimensions/Packaging: | TSSOP-28 |
|
Other/속도: | 70ns |
|
Other: | 256K(32K x 8) |
|
Other/메모イ형: | SRAM - 비동기 |
|
Other/Background - 공급: | 2.7 V ~ 3.6 V |
|
Other/Case/Package: | 28-TSSOP(0.465 |
|
Other/イ터페동: | 병렬 |
|
Other/메모イ형식: | RAM |
|
Other/작동온도: | -40°C ~ 85°C |
|
Other/계 New: | MoBL® |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS62C256AL-45TLI-TR
|
Integrated Silicon Solution | 完全替代 | TSOP-28 |
SRAM Chip Async Single 5V 256Kbit 32K x 8 45ns 28Pin TSOP-I T/R
|
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