Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 56 |
|
Encapsulation parameters/Encapsulation: | TFSOP-56 |
|
Dimensions/Height: | 1.05 mm |
|
Dimensions/Packaging: | TFSOP-56 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Nexperia | 功能相似 | TSSOP-56 |
Buffer/Line Driver 20CH Non-Inverting 3-ST CMOS 56Pin TSSOP T/R
|
||
74ALVCH162827DGG,1
|
NXP | 功能相似 | SOT-364-56 |
Buffer/Line Driver 20CH Non-Inverting 3-ST CMOS 56Pin TSSOP T/R
|
||
74ALVCH162827DGGS
|
Nexperia | 类似代替 | TFSOP-56 |
IC BUFFER DVR 3-ST 20Bit 56TSSOP
|
||
74ALVCH162827DGGS
|
NXP | 类似代替 | TFSOP-56 |
IC BUFFER DVR 3-ST 20Bit 56TSSOP
|
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