Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation (metric): | 2012 |
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Encapsulation parameters/Encapsulation: | 0805 |
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Dimensions/Length: | 2 mm |
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Dimensions/Width: | 1.25 mm |
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Dimensions/Packaging (Metric): | 2012 |
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Dimensions/Packaging: | 0805 |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
VISHAY | 类似代替 | 0805 |
VISHAY 595D225X0010T2T 表面贴装钽电容, 595D系列, 2.2 µF, ± 20%, 10 V, 0805 [2012 公制], T
|
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595D225X0010T2T
|
Vishay Semiconductor | 类似代替 | 0805 |
VISHAY 595D225X0010T2T 表面贴装钽电容, 595D系列, 2.2 µF, ± 20%, 10 V, 0805 [2012 公制], T
|
||
595D225X0010T2W
|
Vishay Semiconductor | 类似代替 | 0805 |
Cap Tant Solid 2.2uF 10V T CASE 20% (2.2 X 1.1 X 1.1mm) SMD 8.6Ω 125℃ T/R
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