Technical parameters/number of contacts: | 10 |
|
Technical parameters/polarity: | Male |
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Technical parameters/Contact electroplating: | Tin |
|
Technical parameters/number of rows: | 2 |
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Technical parameters/number of pins: | 10 |
|
Technical parameters/rated current (Max): | 6.3A/contact |
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Technical parameters/operating temperature (Max): | 105 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Technical parameters/rated voltage (Max): | 550 VAC |
|
Encapsulation parameters/installation method: | Through Hole |
|
Packaging parameters/pin spacing: | 2.54 mm |
|
Dimensions/Height: | 8.38 mm |
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Dimensions/Pin Spacing: | 2.54 mm |
|
Physical parameters/shell color: | Natural |
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Physical parameters/contact material: | Phosphor Bronze |
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Physical parameters/operating temperature: | -55℃ ~ 105℃ |
|
Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bag |
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Other/Manufacturing Applications: | -, Industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/06/15 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
67996-210HLF
|
Future Communications IC | 类似代替 |
AMPHENOL FCI 67996-210HLF Board-To-Board Connector, 2.54mm, 10Contacts, Header, BergStik 67996 Series, Through Hole, 2Rows
|
|||
67996-210HLF
|
Amphenol ICC | 类似代替 |
AMPHENOL FCI 67996-210HLF Board-To-Board Connector, 2.54mm, 10Contacts, Header, BergStik 67996 Series, Through Hole, 2Rows
|
|||
67997-210HLF
|
Amphenol | 类似代替 | 间距P=2.54mm |
67997-210HLF,直插,双排,10P,间距2.54mm 袋装
|
||
|
|
Amphenol ICC | 类似代替 |
67997-210HLF,直插,双排,10P,间距2.54mm 袋装
|
|||
|
|
Future Communications IC | 类似代替 |
67997-210HLF,直插,双排,10P,间距2.54mm 袋装
|
|||
67997-210HLF
|
FCI Electronics | 类似代替 |
67997-210HLF,直插,双排,10P,间距2.54mm 袋装
|
|||
HTSW-105-07-H-D
|
Samtec | 完全替代 |
Conn Unshrouded Header HDR 10POS 2.54mm Solder ST Thru-Hole
|
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