Technical parameters/number of output interfaces: | 1 |
|
Technical parameters/power supply current: | 80 µA |
|
Technical parameters/number of circuits: | 1 |
|
Technical parameters/number of channels: | 1 |
|
Technical parameters/dissipated power: | 500 mW |
|
Technical parameters/bandwidth: | 13 MHz |
|
Technical parameters/number of inputs: | 16 |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/3dB bandwidth: | 70 MHz |
|
Technical parameters/dissipated power (Max): | 500 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 24 |
|
Encapsulation parameters/Encapsulation: | SOIC-24 |
|
Dimensions/Length: | 15.6 mm |
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Dimensions/Width: | 7.6 mm |
|
Dimensions/Height: | 2.45 mm |
|
Dimensions/Packaging: | SOIC-24 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD4067BE
|
TI | 功能相似 | DIP-24 |
TEXAS INSTRUMENTS CD4067BE 芯片, 模拟多路复用器/信号分离器
|
||
CD74HC4067M96
|
TI | 功能相似 | SOIC-24 |
TEXAS INSTRUMENTS CD74HC4067M96 芯片, 模拟多路复用器/信号分离器, 单路, 16:1, SOIC-24
|
||
HEF4067BT,653
|
NXP | 类似代替 | SOIC-24 |
NXP HEF4067BT,653 芯片, 模拟多路复用器/信号分离器, 单路, 16:1, SOIC24
|
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