Technical parameters/dissipated power: | 135 mW |
|
Technical parameters/operating temperature (Max): | 70 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Encapsulation parameters/installation method: | Through Hole |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC-8 |
|
Dimensions/Length: | 5.08 mm |
|
Dimensions/Width: | 3.94 mm |
|
Dimensions/Height: | 3.17 mm |
|
Dimensions/Packaging: | SOIC-8 |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-0700#060
|
Broadcom | 完全替代 | SOIC-8 |
OPTOISO 3.75kV DARL W/BASE 8SOIC
|
||
HCPL-0700#060
|
AVAGO Technologies | 完全替代 | SO |
OPTOISO 3.75kV DARL W/BASE 8SOIC
|
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