Technical parameters/rise/fall time: | 50ns, 30ns |
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Technical parameters/number of output interfaces: | 6 |
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Technical parameters/output voltage: | 100 mV |
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Technical parameters/output current: | 350 mA |
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Technical parameters/drain source resistance: | 75 Ω |
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Technical parameters/dissipated power: | 1.4 W |
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Technical parameters/rise time: | 50 ns |
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Technical parameters/descent time: | 30 ns |
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Technical parameters/descent time (Max): | 80 ns |
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Technical parameters/rise time (Max): | 100 ns |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | 40 ℃ |
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Technical parameters/dissipated power (Max): | 1400 mW |
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Technical parameters/power supply voltage: | 12V ~ 20V |
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Technical parameters/power supply voltage (Max): | 20 V |
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Technical parameters/power supply voltage (Min): | 12 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 28 |
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Encapsulation parameters/Encapsulation: | SOIC-28 |
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Dimensions/Height: | 2.35 mm |
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Dimensions/Packaging: | SOIC-28 |
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Physical parameters/operating temperature: | -40℃ ~ 150℃ (TJ) |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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