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Description Res Thick Film Array 560KΩ 5% 200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Convex SMD Punched Carrier T/R
Product QR code
Packaging 0603
Delivery time
Packaging method Cut Tape (CT)
Standard packaging quantity 1
0.18  yuan 0.18yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(1528) Minimum order quantity(1)
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Technical parameters/number of contacts:

8

 

Technical parameters/rated voltage (DC):

100 V

 

Technical parameters/resistance:

560 KΩ

 

Technical parameters/resistance deviation:

±5 %

 

Technical parameters/accuracy:

±5 %

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

8

 

Encapsulation parameters/Encapsulation (metric):

1608

 

Encapsulation parameters/Encapsulation:

0603

 

Dimensions/Length:

3.2 mm

 

Dimensions/Width:

1.6 mm

 

Dimensions/Height:

0.5 mm

 

Dimensions/Packaging (Metric):

1608

 

Dimensions/Packaging:

0603

 

Dimensions/Thickness:

500 µm

 

Physical parameters/temperature coefficient:

±200 ppm/℃

 

Other/Product Lifecycle:

Unknown

 

Other/Packaging Methods:

Cut Tape (CT)

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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Alternative material

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NRSNA6I4J474TRF NRSNA6I4J474TRF NIC 功能相似 1206
Res Thick Film Array 470KΩ 5% 200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Convex SMD Paper T/R
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NRSNA6I4J514TRF NRSNA6I4J514TRF NIC 功能相似 1206
Res Thick Film Array 510KΩ 5% 200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Convex SMD T/R
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