Technical parameters/power supply voltage (DC): | 3.30 V |
|
Technical parameters/number of logic gates: | 24000 |
|
Technical parameters/I/O pin count: | 218 |
|
Technical parameters/power supply voltage: | 3V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | BGA-256 |
|
Dimensions/Packaging: | BGA-256 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ (TJ) |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 218 IOs
|
||
EPF6024ABC256-3
|
Altera | 完全替代 | BGA-256 |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 218 IOs
|
||
|
|
Intel | 功能相似 | QFP |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 171 IOs
|
||
EPF6024AQC208-3N
|
Altera | 功能相似 | QFP-208 |
FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 171 IOs
|
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