Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage: | 2.5 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 356 |
|
Encapsulation parameters/Encapsulation: | BGA-356 |
|
Dimensions/Height: | 1.1 mm |
|
Dimensions/Packaging: | BGA-356 |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 类似代替 | LBGA |
FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 274 IOs
|
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