Technical parameters/power supply voltage (DC): | 4.75V (min) |
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Technical parameters/number of pins: | 28 |
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Technical parameters/access time: | 70 ns |
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Technical parameters/memory capacity: | 32000 B |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 4.75V ~ 5.25V |
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Technical parameters/power supply voltage (Max): | 5.25 V |
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Technical parameters/power supply voltage (Min): | 4.75 V |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 28 |
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Encapsulation parameters/Encapsulation: | EDIP-28 |
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Dimensions/Length: | 39.12 mm |
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Dimensions/Width: | 18.8 mm |
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Dimensions/Height: | 9.4 mm |
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Dimensions/Packaging: | EDIP-28 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Embedded Design & Development |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1230Y-70IND+
|
Maxim Integrated | 类似代替 | EDIP-28 |
MAXIM INTEGRATED PRODUCTS DS1230Y-70IND+ 芯片, 存储器, NVRAM
|
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