Chip AI consultant
Physical parameters/contact material: | Beryllium Copper |
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Other/Contact Plating: | Gold |
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Other/Competitions: | 50(ohm) |
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Other/Contact Materials: | Beryllium Copper |
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Other/Body Materials: | Brass |
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Other/Matching Styles: | Panel |
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Other/Rad Hardened: | No |
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Other/Genter: | F/M |
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Other/Product Length (mm): | 38.6(mm) |
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Other/Product Diameter (mm): | 19.05(mm) |
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Other/Body Plating: | Silver |
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Other/Product Depth (mm): | Not Required(mm) |
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Other/Product Height (mm): | Not Required(mm) |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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