Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG508ADJ+
|
Maxim Integrated | 功能相似 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG508ADJ+ 芯片, 模拟多路复用器, 单路, 8:1, DIP-16
|
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