Technical parameters/number of circuits: | 1 |
|
Technical parameters/number of channels: | 4 |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | 55 ℃ |
|
Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 4.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 9.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | 55℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD74HCT173M96
|
TI | 类似代替 | SOIC-16 |
高速CMOS逻辑四路D型触发器,三态 High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State
|
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