Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8970401CA
|
TI | 完全替代 | CDIP |
高速CMOS逻辑8位串行输入/并行输出移位寄存器 High-Speed CMOS Logic 8-Bit Serial-In/Parallel-Out Shift Register
|
||
CD54HC164F
|
TI | 完全替代 | CDIP |
高速CMOS逻辑8位串行输入/并行输出移位寄存器 High-Speed CMOS Logic 8-Bit Serial-In/Parallel-Out Shift Register
|
||
CD54HCT164F3A
|
TI | 完全替代 | CDIP-16 |
高速CMOS逻辑8位串行输入/并行输出移位寄存器 High-Speed CMOS Logic 8-Bit Serial-In/Parallel-Out Shift Register
|
||
|
|
Intersil | 功能相似 | DIP |
TEXAS INSTRUMENTS CD74HC164E 移位寄存器, HC系列, 串行至并行, 1元件, DIP, 14 引脚, 2 V, 6 V
|
||
CD74HC164E
|
TI | 功能相似 | PDIP-14 |
TEXAS INSTRUMENTS CD74HC164E 移位寄存器, HC系列, 串行至并行, 1元件, DIP, 14 引脚, 2 V, 6 V
|
||
CD74HC165E
|
National Semiconductor | 功能相似 | PDIP |
TEXAS INSTRUMENTS CD74HC165E 移位寄存器, HC系列, 并行至串行, 1元件, DIP, 16 引脚, 2 V, 6 V
|
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