Technical parameters/Contact electroplating: | Gold |
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Encapsulation parameters/installation method: | Panel |
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Dimensions/Length: | 19.3 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/medium materials: | Tetrafluoroethylene (TFE) |
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Other/Product Lifecycle: | Active |
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Other/Manufacturing Applications: | Signal, Power |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standards/ELV standards: | Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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