Technical parameters/Contact electroplating: | Gold |
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Encapsulation parameters/installation method: | Through Hole |
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Physical parameters/contact material: | Beryllium Copper |
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Other/Packaging Methods: | Bulk |
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Other/Manufacturing Applications: | Military and Aviation, Aeronautics, Defense, Defense, Military and Aviation, Aerospace, Defence, Military, Aviation Electronics |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standards/military grade: | Yes |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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