Technical parameters/number of pins: | 2 |
|
Technical parameters/dissipated power: | 300 mW |
|
Technical parameters/test current: | 5 mA |
|
Technical parameters/voltage regulation value: | 13 V |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Technical parameters/dissipated power (Max): | 300 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
|
Encapsulation parameters/Encapsulation: | SOD-323 |
|
Dimensions/Length: | 1.8 mm |
|
Dimensions/Width: | 1.35 mm |
|
Dimensions/Height: | 1.05 mm |
|
Dimensions/Packaging: | SOD-323 |
|
Physical parameters/temperature coefficient: | 9.4 mV/K |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Cut Tape (CT) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZX384-B13
|
NXP | 类似代替 | SOD-323 |
300mW,BZX384 系列,NXP Semiconductors 齐纳电压容差为 2% (BZX384-B) 和大约 5% (BZX384-C) 表面安装外壳:SOD-323 (SC-76) ### 齐纳二极管,NXP Semiconductors
|
||
BZX384-B13
|
Nexperia | 类似代替 | SOD-323 |
300mW,BZX384 系列,NXP Semiconductors 齐纳电压容差为 2% (BZX384-B) 和大约 5% (BZX384-C) 表面安装外壳:SOD-323 (SC-76) ### 齐纳二极管,NXP Semiconductors
|
||
BZX384-B13,115
|
NXP | 类似代替 | SOD-323 |
BZX384-B13,115 编带
|
||
BZX384-B13,115
|
Nexperia | 类似代替 | SOD-323 |
BZX384-B13,115 编带
|
||
PZU13B1,115
|
NXP | 类似代替 | SOD-323 |
SOD-323F 12.75V 550mW
|
||
PZU13B3,115
|
NXP | 类似代替 | SOD-323 |
SOD-323F 13.665V 550mW
|
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