Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AIH10H300N-L
|
Artesyn Embedded Technologies | 类似代替 | MODULE |
Module DC-DC 300Vin 1Out 24V 10.4A 250W 18Pin
|
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