Encapsulation parameters/installation method: | PCB |
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Other/Heating Materials: | Polybutylene Terephthalate |
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Other/Genter: | F |
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Other/Counting: | Through Hole |
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Other/Lead Finish: | Tin|Nickel |
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Other/Determination Methods: | Solder |
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Other/Body Orientation: | Right Angle |
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Other/Contact Materials: | Brass/Brass/Phosphor Bronze/Brass |
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Other/Contact Plating: | Nickel/Tin/Tin/Tin |
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Other/Product Length: | 9 mm |
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Other/Product Dimensions: | 9 x 15.2 x 11 mm |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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