Chip AI consultant
Technical parameters/rise/fall time: | 1.8ns, 1.9ns |
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Technical parameters/number of channels: | 1 |
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Technical parameters/dissipated power: | 50 mW |
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Technical parameters/isolation voltage: | 5000 Vrms |
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Technical parameters/descent time (Max): | 3.9 ns |
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Technical parameters/rise time (Max): | 3.9 ns |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/dissipated power (Max): | 50 mW |
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Technical parameters/power supply voltage: | 2.25V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ISO7710FDW
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TI | 完全替代 | SOIC-16 |
数字隔离器 High Speed, Robust EMC Reinforced Single-Channel Digital Isolator 16-SOIC -55 to 125
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