Encapsulation parameters/Encapsulation: | MODULE |
|
Dimensions/Packaging: | MODULE |
|
Other/Product Lifecycle: | Unknown |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Agilent | 功能相似 | MODULE |
Infrared Transceivers 1m 3V FIR
|
||
HSDL-3602-007
|
AVAGO Technologies | 功能相似 | MODULE |
Infrared Transceivers 1m 3V FIR
|
||
HSDL-3602-007
|
LITE | 功能相似 |
Infrared Transceivers 1m 3V FIR
|
|||
HSDL-3602-007
|
LiteOn | 功能相似 | SMD |
Infrared Transceivers 1m 3V FIR
|
||
|
|
LITE | 功能相似 |
红外收发器 1m 3V FIR 1800uni ts T/R
|
|||
|
|
Broadcom | 功能相似 |
红外收发器 1m 3V FIR 1800uni ts T/R
|
|||
HSDL-3602-037
|
LiteOn | 功能相似 | MODULE |
红外收发器 1m 3V FIR 1800uni ts T/R
|
||
HSDL-3602-037
|
AVAGO Technologies | 功能相似 | MODULE |
红外收发器 1m 3V FIR 1800uni ts T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review