Technical parameters/rated voltage (DC): | 25.0 V |
|
Technical parameters/capacitance: | 3.3 µF |
|
Technical parameters/tolerances: | ±10 % |
|
Technical parameters/dielectric properties: | X7R |
|
Technical parameters/product series: | GRM |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/rated voltage: | 25 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation (metric): | 2012 |
|
Encapsulation parameters/Encapsulation: | 0805 |
|
Dimensions/Length: | 2 mm |
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Dimensions/Width: | 1.25 mm |
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Dimensions/Height: | 1.25 mm |
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Dimensions/Packaging (Metric): | 2012 |
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Dimensions/Packaging: | 0805 |
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Dimensions/Thickness: | 1.25 mm |
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Physical parameters/materials: | X7R/-55℃~+125℃ |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
|
Physical parameters/temperature coefficient: | ±15 % |
|
Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Cut Tape (CT) |
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Other/Minimum Packaging: | 3000 |
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Other/Manufacturing Applications: | Portable Devices, Industrial, Power Management, General, Portable Devices, Consumer Electronics, Industrial, Power Management, Consumer Electronics |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
C2012X7R1E335K125AB
|
TDK | 功能相似 | 0805 |
TDK C2012X7R1E335K125AB 多层陶瓷电容器, 表面贴装, C系列, 3.3 µF, ± 10%, X7R, 25 V, 0805 [2012 公制]
|
||
CGA4J1X7R1E335K125AC
|
TDK | 功能相似 | 0805 |
0805 3.3uF ±10% 25V X7R
|
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