Technical parameters/tolerances: | ±5 % |
|
Technical parameters/resistance: | 56 Ω |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | 0804 |
|
Dimensions/Packaging: | 0804 |
|
Physical parameters/operating temperature: | -55℃ ~ 125℃ |
|
Physical parameters/temperature coefficient: | ±250 ppm/℃ |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Manufacturing Applications: | - |
|
Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
741C083560JP
|
CTS | 功能相似 | 0804 |
741 系列 0402 0.063 W 56 Ohm ±5 % 25 V 表面贴装 贴片电阻阵列
|
||
CAT10-560J4LF
|
Bourns J.W. Miller | 功能相似 | 0804 |
56Ω (560) ±5% 编带
|
||
CRA04P08356R0JTD
|
Vishay Dale | 类似代替 | 0804 |
Res Thick Film Array 56Ω 5% ±200ppm/℃ ISOL Molded 8Pin 0804 Concave SMD Paper T/R
|
||
|
|
VISHAY | 类似代替 |
Res Thick Film Array 56Ω 5% ±200ppm/℃ ISOL Molded 8Pin 0804 Concave SMD Paper T/R
|
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