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Model CL21B473KBANNNC

Description 0805 0.047 uF ±10 % 容差 50 V X7R 表面贴装多层陶瓷电容

Brand: Samsung

Packaging 0805

Delivery time

Packaging method Tape & Reel (TR)

Standard packaging quantity 1

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Technical parameters/rated voltage (DC):	50.0 V
Technical parameters/capacitance:	0.047 µF
Technical parameters/tolerances:	±10 %
Technical parameters/dielectric properties:	X7R
Technical parameters/operating temperature (Max):	125 ℃
Technical parameters/operating temperature (Min):	-55 ℃
Technical parameters/accuracy:	±10 %
Technical parameters/rated voltage:	50 V
Encapsulation parameters/installation method:	Surface Mount
Encapsulation parameters/Encapsulation (metric):	2012
Encapsulation parameters/Encapsulation:	0805
Dimensions/Length:	2 mm
Dimensions/Width:	1.25 mm
Dimensions/Height:	0.65 mm
Dimensions/Packaging (Metric):	2012
Dimensions/Packaging:	0805
Dimensions/Thickness:	0.65 mm
Physical parameters/materials:	X7R/-55℃~+125℃
Physical parameters/operating temperature:	-55℃ ~ 125℃
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tape & Reel (TR)
Other/Minimum Packaging:	4000
Other/Manufacturing Applications:	General
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free

Alternative material

Model	Brand	Similarity	Encapsulation	Introduction	Data manual
CL21B473KBCNNNC	Samsung	完全替代	0805	CL21系列 0805 0.047 uF 50 V 10 % X7R SMD 多层陶瓷电容	PDF
CL21B473KBCNNND	Samsung	类似代替	0805	Samsung 0805 X7R/Y5V MLCC series reels ### 0805 系列镍挡板终端覆镀锡 (NiSn) 层，应用包括移动电话、视频和调谐器设计，COG/NPO 是温度补偿的最常见配方，为 EIA I 类陶瓷材料，X7R、X5R 配方称为温度稳定陶瓷，属于 EIA II 类材料，Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。	PDF
CL21B473KBCNNNL	Samsung	完全替代	0805	Samsung 0805 X7R/Y5V MLCC series reels ### 0805 系列镍挡板终端覆镀锡 (NiSn) 层，应用包括移动电话、视频和调谐器设计，COG/NPO 是温度补偿的最常见配方，为 EIA I 类陶瓷材料，X7R、X5R 配方称为温度稳定陶瓷，属于 EIA II 类材料，Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。	PDF