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Model CC1111F16RSP

Description 低功耗的SoC （系统级芯片）与MCU，存储器，低于1GHz的射频收发器和USB控制器 Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Controller

Brand: TI

Packaging QFN-36

Delivery time

Packaging method Tray

Standard packaging quantity 1

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Technical parameters/frequency:	300MHz ~ 348MHz,391MHz ~ 464MHz,782MHz ~ 928MHz
Technical parameters/power supply voltage (DC):	3.00V (min)
Technical parameters/power supply current:	300 nA
Technical parameters/clock frequency:	24.0 MHz
Technical parameters/RAM size:	2 KB
Technical parameters/data rate:	500 kbps
Technical parameters/FLASH memory capacity:	32768 B
Technical parameters/output power:	10 dBm
Technical parameters/number of ART:	1
Technical parameters/standby current:	300 nA
Technical parameters/antenna wiring:	Differential
Technical parameters/operating temperature (Max):	85 ℃
Technical parameters/operating temperature (Min):	0 ℃
Technical parameters/power supply voltage:	3V ~ 3.6V
Technical parameters/power supply voltage (Max):	3.6 V
Technical parameters/power supply voltage (Min):	3 V
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	36
Encapsulation parameters/Encapsulation:	QFN-36
Dimensions/Packaging:	QFN-36
Physical parameters/operating temperature:	0℃ ~ 85℃
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tray
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/06/15

Alternative material

	Model	Brand	Similarity	Encapsulation	Introduction	Data manual
	CC1111F32RSP	TI	类似代替	QFN-36	低功耗的SoC （系统级芯片）与MCU，存储器，低于1GHz的射频收发器和USB控制器 Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Controller
	CC1111F32RSPR	TI	类似代替	QFN-36	低功耗的SoC （系统级芯片）与MCU，存储器，低于1GHz的射频收发器和USB控制器 Low-Power SoC (System-on-Chip) with MCU, Memory, Sub-1 GHz RF Transceiver, and USB Controller