Encapsulation parameters/Encapsulation: | ThroughHole |
|
Dimensions/Packaging: | ThroughHole |
|
Other/Product Lifecycle: | Active |
|
Other/Manufacturing Applications: | - |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BH4B-XH-2
|
JST | 功能相似 |
高壁结构,以防止用于覆盖PC板的树脂与嵌合针接触。专门设计用于PCB板。插头设计用于兼容XH配套插座。
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review