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Description 120mA,NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器,NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
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Brand: NXP
Packaging SOT-23-3
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0.23  yuan 0.23yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(4025) Minimum order quantity(1)
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Technical parameters/number of pins:

3

 

Technical parameters/forward voltage:

1V @15mA

 

Technical parameters/forward current:

70 mA

 

Technical parameters/Maximum forward surge current (Ifsm):

100 mA

 

Technical parameters/forward voltage (Max):

410 mV

 

Technical parameters/forward current (Max):

70 mA

 

Technical parameters/operating temperature (Max):

150 ℃

 

Technical parameters/operating temperature (Min):

-65 ℃

 

Technical parameters/operating temperature:

150℃ (Max)

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

3

 

Encapsulation parameters/Encapsulation:

SOT-23-3

 

Dimensions/Length:

3 mm

 

Dimensions/Width:

1.4 mm

 

Dimensions/Height:

1 mm

 

Dimensions/Packaging:

SOT-23-3

 

Physical parameters/operating temperature:

-65℃ ~ 150℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Tape & Reel (TR)

 

Other/Manufacturing Applications:

Power Management, Test & Measurement, Industrial, Testing and Measurement, Power Management

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

Compliant with the REACH SVHC standard:

No SVHC

 

Compliant with standard/REACH SVHC version:

2015/12/17

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
BAS70-05,235 BAS70-05,235 NXP 类似代替 SOT-23-3
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二极管与整流器
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BAS70-05-7-F BAS70-05-7-F Multicomp 功能相似 SOT-23
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BAS70-05FILM BAS70-05FILM ST Microelectronics 功能相似 SOT-23-3
1A,STMicroelectronics 高功率、高效率和高密度。 ### 二极管和整流器,STMicroelectronics
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