Chip AI consultant
Package parameters/number of pins: | 32 |
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Encapsulation parameters/Encapsulation: | TSOP |
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Dimensions/Packaging: | TSOP |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other operating temperatures: | 0 to 70 °C |
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Other/Maximum Random Access Time: | 12 ns |
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Other/Counting: | Surface Mount |
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Other/Pin Count: | 32 |
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Other/Sensitivity: | 1 Mb |
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Other/Maximum Operating Supply Voltage: | 3.6 V |
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Other/Minimum Operating Supply Voltage: | 3 V |
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Other/Product Dimensions: | 8.2 x 18.6 x 1.05 mm |
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Other/Number of Words: | 128 kWords |
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Other/Supplier Packages: | TSOP-I |
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Other/Address Bus Width: | 17 Bit |
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Other/Number of Bits per Word: | 8 Bit |
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Other/Number of I/O Lines: | 8 Bit |
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Other/Number of Ports: | 1 |
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Other/Timing Types: | Asynchronous |
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Other/Typical Operating Supply Voltage: | 3.3000 V |
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Other/Maximum Operating Current: | 65 mA |
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Other/Creating Levels: | Commercial |
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Other/ECCN: | BE11_TBD |
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Other/SCHEDULE B: | 8542320040 |
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Other/HTSN: | 8542320040 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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