Technical parameters/tolerances: | ±2 % |
|
Technical parameters/rated power: | 1.25 W |
|
Technical parameters/resistance: | 120 Ω |
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Technical parameters/resistance deviation: | ±2 % |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 10 |
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Encapsulation parameters/Encapsulation: | SIP-10 |
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Dimensions/Packaging: | SIP-10 |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Physical parameters/temperature coefficient: | ±100 ppm/℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Box (TB) |
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Other/Manufacturing Applications: | - |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
4610X-101-121
|
Bourns J.W. Miller | 完全替代 | SIP-10 |
Res Thick Film NET 120Ω 2% 1.25W ±100ppm/℃ BUS Molded 10Pin SIP Pin Thru-Hole
|
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