Technical parameters/power supply current: | 35 mA |
|
Technical parameters/digits: | 8, 16 |
|
Technical parameters/access time (Max): | 70 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Package parameters/number of pins: | 48 |
|
Encapsulation parameters/Encapsulation: | TSOP |
|
Dimensions/Packaging: | TSOP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Customs information/ECCN code: | 3A991.b.1.a |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
CREE | 类似代替 |
SPANSION S29GL032N90TFI040 闪存, 32 Mbit, 4M x 8位 / 2M x 16位, CFI, TSOP, 48 引脚
|
|||
S29GL032N90TFI040
|
Spansion | 类似代替 | TSOP-48 |
SPANSION S29GL032N90TFI040 闪存, 32 Mbit, 4M x 8位 / 2M x 16位, CFI, TSOP, 48 引脚
|
||
S29GL032N90TFI040
|
AMD | 类似代替 |
SPANSION S29GL032N90TFI040 闪存, 32 Mbit, 4M x 8位 / 2M x 16位, CFI, TSOP, 48 引脚
|
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