Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 14 |
|
Encapsulation parameters/Encapsulation: | DFP |
|
Dimensions/Packaging: | DFP |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tube, Rail |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLC2254AMWB
|
TI | 功能相似 | CFPAK |
高级LinCMOS⑩轨到轨极低功耗运算放大器 Advanced LinCMOS⑩ RAIL-TO-RAIL VERY LOW-POWER OPERATIONAL AMPLIFIERS
|
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