Technical parameters/number of contacts: | 68 |
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Technical parameters/polarity: | Female |
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Technical parameters/Contact electroplating: | Gold, Gold over Nickel |
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Technical parameters/rated current: | 500 mA |
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Technical parameters/Insulation resistance: | 1.00 GΩ |
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Technical parameters/number of rows: | 2 |
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Technical parameters/number of pins: | 136 |
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Encapsulation parameters/installation method: | Surface Mount |
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Packaging parameters/pin spacing: | 800 µm |
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Dimensions/Height: | 10.8 mm |
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Dimensions/Pin Spacing: | 800 µm |
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Physical parameters/contact material: | Phosphor Bronze |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2990
|
FCI Electronics | 功能相似 |
Board Connector, 2 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator
|
|||
2990
|
NXP | 功能相似 | SOP |
Board Connector, 2 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator
|
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