Technical parameters/Contact electroplating: | Tin Lead |
|
Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Length: | 19.74 mm |
|
Dimensions/Height: | 4.75 mm |
|
Physical parameters/contact material: | Brass Alloy |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2812-1-00-01-00-00-07-0
|
Mill-Max | 完全替代 |
IC 与器件插座 200u SN/PB OVER NI
|
|||
2812-1-00-80-00-00-07-0
|
Mill-Max | 功能相似 |
IC 与器件插座 200u SN OVER NI
|
|||
8121
|
Qualtek | 功能相似 | Vertical, 4 PC Pin |
PCB Terminal, ROHS COMPLIANT
|
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