Technical parameters/Contact electroplating: | Tin Lead |
|
Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Length: | 12.67 mm |
|
Physical parameters/contact material: | Brass Alloy |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Mill-Max | 完全替代 | Through Hole |
Contact PIN Solder ST Thru-Hole Bulk
|
||
2708-3-00-80-00-00-07-0
|
Mill-Max | 功能相似 |
IC & Component Sockets 200u SN OVER NI
|
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