Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Length: | 6.10 mm |
|
Physical parameters/contact material: | Copper Alloy |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2507-2-01-01-00-00-07-0
|
Mill-Max | 功能相似 |
Conn Pc Pin Circ .064dia Tinlead
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|
Mill-Max | 功能相似 | Through Hole |
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
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