Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AT93C46DY6-YH-T
|
Microchip | 功能相似 | UDFN-8 |
MICROCHIP AT93C46DY6-YH-T EEPROM, 3 Wire, Serial, 1Kbit, 128K x 8Bit / 64K x 16Bit, 2MHz, UDFN, 8Pins
|
||
AT93C46DY6-YH-T
|
ATMEL | 功能相似 | UDFN-8 |
MICROCHIP AT93C46DY6-YH-T EEPROM, 3 Wire, Serial, 1Kbit, 128K x 8Bit / 64K x 16Bit, 2MHz, UDFN, 8Pins
|
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