Technical parameters/frequency: | 0.4 MHz |
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Technical parameters/power supply voltage (DC): | 5.00 V, 5.50 V (max) |
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Technical parameters/operating voltage: | 2.5V ~ 5.5V |
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Technical parameters/power supply current: | 3 mA |
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Technical parameters/number of pins: | 8 |
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Technical parameters/clock frequency: | 400 kHz |
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Technical parameters/access time: | 3500 ns |
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Technical parameters/memory capacity: | 125 B |
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Technical parameters/Input capacitance: | 10 pF |
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Technical parameters/rise time: | 300 ns |
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Technical parameters/descent time: | 300 ns |
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Technical parameters/access time (Max): | 900 ns |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/power supply voltage: | 2.5V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 2.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.9 mm |
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Dimensions/Height: | 1.25 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Industrial, Computer and Computer Peripherals, Communication and Networking, Consumer Electronics, Consumer Electronics, Industrial, Automotive, Communications& Networking |
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