Chip AI consultant
Technical parameters/output current: | ≤50 mA |
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Technical parameters/power supply current: | 750 µA |
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Technical parameters/number of circuits: | 4 |
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Technical parameters/number of channels: | 4 |
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Technical parameters/dissipated power: | 1022 mW |
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Technical parameters/Common Mode Rejection Ratio: | 70 dB |
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Technical parameters/input compensation drift: | 2.00 µV/K |
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Technical parameters/bandwidth: | 1.75 MHz |
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Technical parameters/conversion rate: | 1.40 V/μs |
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Technical parameters/gain bandwidth product: | 1.81 MHz |
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Technical parameters/input compensation voltage: | 300 µV |
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Technical parameters/input bias current: | 1 pA |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/gain bandwidth: | 1.81 MHz |
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Technical parameters/dissipated power (Max): | 1022 mW |
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Technical parameters/Common Mode Rejection Ratio (Min): | 70 dB |
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Technical parameters/power supply voltage: | 2.7V ~ 10V |
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Technical parameters/power supply voltage (Max): | 10 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 14 |
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Encapsulation parameters/Encapsulation: | SOIC-14 |
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Dimensions/Length: | 8.65 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-14 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Active |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2444AID
|
TI | 类似代替 | SOIC-14 |
高级LinCMOS轨到轨输出，宽输入电压运算放大器 Advanced LinCMOS RAIL-TO-RAIL OUTPUT WIDE-INPUT-VOLTAGE OPERATIONAL AMPLIFIERS
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