Technical parameters/output current: | ≤50 mA |
| ||||
Technical parameters/power supply current: | 750 µA |
| ||||
Technical parameters/number of circuits: | 2 |
| ||||
Technical parameters/number of channels: | 2 |
| ||||
Technical parameters/dissipated power: | 725 mW |
| ||||
Technical parameters/Common Mode Rejection Ratio: | 70dB ~ 75dB |
| ||||
Technical parameters/input compensation drift: | 2.00 µV/K |
| ||||
Technical parameters/bandwidth: | 1.75 MHz |
| ||||
Technical parameters/conversion rate: | 1.40 V/μs |
| ||||
Technical parameters/gain bandwidth product: | 1.81 MHz |
| ||||
Technical parameters/input compensation voltage: | 2 mV |
| ||||
Technical parameters/input bias current: | 1 pA |
| ||||
Technical parameters/operating temperature (Max): | 85 ℃ |
| ||||
Technical parameters/operating temperature (Min): | -40 ℃ |
| ||||
Technical parameters/gain bandwidth: | 1.81 MHz |
| ||||
Technical parameters/dissipated power (Max): | 725 mW |
| ||||
Technical parameters/Common Mode Rejection Ratio (Min): | 70 dB |
| ||||
Technical parameters/power supply voltage: | 2.7V ~ 10V |
| ||||
Technical parameters/power supply voltage (Max): | 10 V |
| ||||
Technical parameters/power supply voltage (Min): | 2.7 V |
| ||||
Encapsulation parameters/installation method: | Surface Mount |
| ||||
Package parameters/number of pins: | 8 |
| ||||
Encapsulation parameters/Encapsulation: | SOIC-8 |
| ||||
Dimensions/Length: | 4.9 mm |
| ||||
Dimensions/Width: | 3.91 mm |
| ||||
Dimensions/Height: | 1.58 mm |
| ||||
Dimensions/Packaging: | SOIC-8 |
| ||||
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
| ||||
Other/Product Lifecycle: | Active |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2442AID
|
TI | 类似代替 | SOIC-8 |
LinCMOS 运算放大器,TLV 系列 ### 运算放大器,Texas Instruments
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review