Encapsulation parameters/installation method: | Through Hole |
|
Package parameters/number of pins: | 24 |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Height: | 4.06 mm |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2732AF6
|
ST Microelectronics | 功能相似 | DIP |
NMOS 32K 4K ×8uV EPROM NMOS 32K 4K x 8uV EPROM
|
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