Technical parameters/Contact electroplating: | Silver |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Encapsulation parameters/installation method: | Solder Lug |
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Dimensions/Length: | 32.54 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/operating temperature: | -55℃ ~ 85℃ |
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Physical parameters/shell material: | Brass |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Other/Manufacturing Applications: | Signal, Power |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standards/ELV standards: | Compliant |
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Customs information/ECCN code: | EAR99 |
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Customs information/HTS code: | 8538908080 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SPC4231
|
Multicomp | 功能相似 |
MULTICOMP SPC4231 射频/同轴转换头, T形, BNC 母-母-母
|
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