Technical parameters/number of contacts: | 20 |
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Technical parameters/Contact electroplating: | Gold, Tin |
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Technical parameters/rated current: | 3 A |
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Technical parameters/number of rows: | 2 |
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Technical parameters/Flammability level: | UL 94 V-0 |
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Technical parameters/number of pins: | 20 |
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Technical parameters/operating temperature (Max): | 105 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Packaging parameters/pin spacing: | 2.54 mm |
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Dimensions/Length: | 25.4 mm |
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Dimensions/Width: | 3.71 mm |
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Dimensions/Pin Spacing: | 2.54 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Other/Manufacturing Applications: | Industrial, Industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2227MC-20-03-F1
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Multicomp | 功能相似 |
MULTICOMP 2227MC-20-03-F1 芯片和元件插座, 2227MC系列, DIP, 20 触点, 2.54 mm, 7.62 mm, 镀锡触芯
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