Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
|
Encapsulation parameters/Encapsulation: | C-MELF |
|
Dimensions/Packaging: | C-MELF |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 完全替代 | SQ-MELF |
ESD 抑制器/TVS 二极管 MIL1 500 W BIPOLAR TVS, SQUARE:SQUARE
|
||
JAN1N6169US
|
Microchip | 完全替代 | C-Package-2 |
ESD 抑制器/TVS 二极管 MIL1 500 W BIPOLAR TVS, SQUARE:SQUARE
|
||
JANTXV1N6169US
|
Microsemi | 功能相似 | SQ-MELF |
Tvs Diode 98.8vwm 187.74vc Cpkg
|
||
JANTXV1N6169US
|
Semtech Corporation | 功能相似 | SMT |
Tvs Diode 98.8vwm 187.74vc Cpkg
|
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