Technical parameters/Contact electroplating: | Gold |
|
Encapsulation parameters/installation method: | PCB, Solder |
|
Dimensions/Length: | 9.52 mm |
|
Dimensions/Width: | 14.27 mm |
|
Dimensions/Height: | 7.92 mm |
|
Physical parameters/contact material: | Beryllium Copper |
|
Physical parameters/insulation material: | Teflon |
|
Physical parameters/shell material: | Brass |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
132357-11
|
Amphenol | 功能相似 | PCB |
AMPHENOL RF 132357-11 射频同轴, SMA, 直型, 母, 端锁定
|
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