Technical parameters/Contact electroplating: | Gold |
|
Encapsulation parameters/installation method: | Panel, Solder |
|
Dimensions/Length: | 17.02 mm |
|
Dimensions/Height: | 5.59 mm |
|
Physical parameters/contact material: | Beryllium Copper |
|
Physical parameters/insulation material: | Teflon |
|
Physical parameters/shell material: | Brass |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
901-9889-RFX
|
Amphenol | 功能相似 | SMA |
AMPHENOL RF 901-9889-RFX 连接器, SMA直同轴插口, 隔板安装
|
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